AI 34%
medium
2026-04-15
Over 100 Million Yuan in R&D in Three Years: This Enterprise Develops Space-Grade Chips Thinner Than Paper
三年研发超亿元 这家企业研制出“比纸更薄”的航天芯片
新华网
xinhua
A company in Shandong has independently developed an aerospace optoelectronic chip that is thinner than paper, with a thickness of only 140 microns, marking a breakthrough in key core technologies for spacecraft communication.
Document Text
234 characters
日前，位于山东淄博高新区的山东中科际联光电集成技术研究院有限公司成功攻克关键核心技术，实现宇航光电芯片自主研制。<br>
这款航天芯片厚度仅140微米，比普通纸片更薄，内部集成整套激光光源核心功能，如同在指甲盖大小的空间内建起一座微型“光电信号加工厂”，可高效传输航天飞行各类指令与数据，保障航天器稳定运行。<br>
历经多年研发攻坚，这家企业已拥有50多项核心技术专利，近3年研发投入累计超1亿元，占营收比重超30%。<br>
作者：朱晓光、曲磊、宗士林<br>
新华社音视频部制作
Topics
aerospace
semiconductors
independent innovation
Metadata
| Publisher | 新华网 |
| Site | xinhua |
| Date | 2026-04-15 |
| Category | report |
| Policy Area | 航天芯片 |
| CMS Category | 媒体报道 |
| Keywords | 芯片 |
Verification